ID: 825
							Intel Core i3-330M - характеристики
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							На данной странице представлена таблица со всеми характеристиками процессора Intel Core i3-330M. Содержание страницы идентично официальному сайту, на котором ограничен доступ жителей России и Беларуси к данной информации.
Краткие характеристики: Техпроцесс: 32 nm, Ядер: 2, Потоков: 4, Базовая частота: 2.13 GHz, Кэш память: 3 MB Intel Smart Cache, TDP: 35 W.
						Краткие характеристики: Техпроцесс: 32 nm, Ядер: 2, Потоков: 4, Базовая частота: 2.13 GHz, Кэш память: 3 MB Intel Smart Cache, TDP: 35 W.
Essentials | |
|---|---|
Product Collection  | Legacy Intel Core Processors  | 
Code Name  | Products formerly Arrandale  | 
Vertical Segment  | Mobile  | 
Processor Number  | i3-330M  | 
Lithography  | 32 nm  | 
CPU Specifications | |
Total Cores  | 2  | 
Total Threads  | 4  | 
Processor Base Frequency  | 2.13 GHz  | 
Cache  | 3 MB Intel Smart Cache  | 
Bus Speed  | 2.5 GT/s  | 
TDP  | 35 W  | 
Supplemental Information | |
Marketing Status  | Discontinued  | 
Launch Date  | Q1'10  | 
Servicing Status  | End of Servicing Updates  | 
Embedded Options Available  | No  | 
Datasheet  | |
Memory Specifications | |
Max Memory Size (dependent on memory type)  | 8 GB  | 
Memory Types  | DDR3 800/1066  | 
Max # of Memory Channels  | 2  | 
Max Memory Bandwidth  | 17.1 GB/s  | 
Physical Address Extensions  | 36-bit  | 
ECC Memory Supported   ‡  | No  | 
Processor Graphics | |
Processor Graphics ‡  | Intel HD Graphics for Previous Generation Intel Processors  | 
Graphics Base Frequency  | 500 MHz  | 
Graphics Max Dynamic Frequency  | 667 MHz  | 
Intel Flexible Display Interface (Intel FDI)  | Yes  | 
Intel Clear Video HD Technology  | Yes  | 
Intel Clear Video Technology  | Yes  | 
Macrovision* License Required  | No  | 
# of Displays Supported ‡  | 2  | 
Expansion Options | |
PCI Express Revision  | 2.0  | 
PCI Express Configurations ‡  | 1x16  | 
Max # of PCI Express Lanes  | 16  | 
Package Specifications | |
Sockets Supported  | BGA1288 |  PGA988  | 
Max CPU Configuration  | 1  | 
TJUNCTION  | 90°C for rPGA |  105°C for BGA  | 
Package Size  | rPGA 37.5mmx 37.5mm |  BGA 34mmx28mm  | 
Processing Die Size  | 81 mm2  | 
# of Processing Die Transistors  | 382 million  | 
Advanced Technologies | |
Intel Turbo Boost Technology ‡  | No  | 
Intel Hyper-Threading Technology ‡  | Yes  | 
Intel 64 ‡  | Yes  | 
Instruction Set  | 64-bit  | 
Instruction Set Extensions  | Intel SSE4.1 |  Intel SSE4.2  | 
Idle States  | Yes  | 
Enhanced Intel SpeedStep Technology  | Yes  | 
Thermal Monitoring Technologies  | Yes  | 
Intel Fast Memory Access  | Yes  | 
Intel Flex Memory Access  | Yes  | 
Security & Reliability | |
Intel AES New Instructions  | No  | 
Intel Trusted Execution Technology ‡  | No  | 
Execute Disable Bit ‡  | Yes  | 
Intel Virtualization Technology (VT-x) ‡  | Yes  | 
Intel Virtualization Technology for Directed I/O (VT-d) ‡  | No  | 
Intel VT-x with Extended Page Tables (EPT) ‡  | Yes  |