ID: 827
Intel Core i3-370M - характеристики
35
На данной странице представлена таблица со всеми характеристиками процессора Intel Core i3-370M. Содержание страницы идентично официальному сайту, на котором ограничен доступ жителей России и Беларуси к данной информации.
Краткие характеристики: Техпроцесс: 32 nm, Ядер: 2, Потоков: 4, Базовая частота: 2.40 GHz, Кэш память: 3 MB Intel Smart Cache, TDP: 35 W.
Краткие характеристики: Техпроцесс: 32 nm, Ядер: 2, Потоков: 4, Базовая частота: 2.40 GHz, Кэш память: 3 MB Intel Smart Cache, TDP: 35 W.
Essentials | |
|---|---|
Product Collection | Legacy Intel Core Processors |
Code Name | Products formerly Arrandale |
Vertical Segment | Mobile |
Processor Number | i3-370M |
Lithography | 32 nm |
CPU Specifications | |
Total Cores | 2 |
Total Threads | 4 |
Processor Base Frequency | 2.40 GHz |
Cache | 3 MB Intel Smart Cache |
Bus Speed | 2.5 GT/s |
TDP | 35 W |
Supplemental Information | |
Marketing Status | Discontinued |
Launch Date | Q3'10 |
Servicing Status | End of Servicing Updates |
Embedded Options Available | No |
Datasheet | |
Memory Specifications | |
Max Memory Size (dependent on memory type) | 8 GB |
Memory Types | DDR3 800/1066 |
Max # of Memory Channels | 2 |
Max Memory Bandwidth | 17.1 GB/s |
Physical Address Extensions | 36-bit |
ECC Memory Supported ‡ | No |
Processor Graphics | |
Processor Graphics ‡ | Intel HD Graphics for Previous Generation Intel Processors |
Graphics Base Frequency | 500 MHz |
Graphics Max Dynamic Frequency | 667 MHz |
Intel Flexible Display Interface (Intel FDI) | Yes |
Intel Clear Video HD Technology | Yes |
Intel Clear Video Technology | Yes |
Macrovision* License Required | No |
# of Displays Supported ‡ | 2 |
Expansion Options | |
PCI Express Revision | 2.0 |
PCI Express Configurations ‡ | 1x16 |
Max # of PCI Express Lanes | 16 |
Package Specifications | |
Sockets Supported | PGA988 |
Max CPU Configuration | 1 |
TJUNCTION | 90°C for rPGA | 105°C for BGA |
Package Size | rPGA 37.5mmx 37.5mm | BGA 34mmx28mm |
Processing Die Size | 81 mm2 |
# of Processing Die Transistors | 382 million |
Advanced Technologies | |
Intel Turbo Boost Technology ‡ | No |
Intel Hyper-Threading Technology ‡ | Yes |
Intel 64 ‡ | Yes |
Instruction Set | 64-bit |
Instruction Set Extensions | Intel SSE4.1 | Intel SSE4.2 |
Idle States | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Thermal Monitoring Technologies | Yes |
Intel Fast Memory Access | Yes |
Intel Flex Memory Access | Yes |
Security & Reliability | |
Intel AES New Instructions | No |
Intel Trusted Execution Technology ‡ | No |
Execute Disable Bit ‡ | Yes |
Intel Virtualization Technology (VT-x) ‡ | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) ‡ | No |
Intel VT-x with Extended Page Tables (EPT) ‡ | Yes |